Hot Release Adhesive Film is a specialized coating applied to PET, PO, PVC, and EVA film substrates. At room temperature, it exhibits adhesive properties, serving as an effective positioning aid. Once the manufacturing process is complete, a quick heat-up to a specific temperature allows for easy peeling. It is ideal for silicon wafer cutting and subsequent transportation steps.
- Positioning for MLCC and MLCI slicing
- Graphene and nanotube transfer on copper substrates
- Wafer and grinding process positioning
- Component positioning on circuit boards
- Positioning for ring pressure-sensitive resistor printing