Thermal Release Film

Hot Release Adhesive Film is a specialized coating applied to PET, PO, PVC, and EVA film substrates. At room temperature, it exhibits adhesive properties, serving as an effective positioning aid. Once the manufacturing process is complete, a quick heat-up to a specific temperature allows for easy peeling. It is ideal for silicon wafer cutting and subsequent transportation steps.

Applications:

• Positioning for MLCC and MLCI slicing
• Graphene and nanotube transfer on copper substrates
• Wafer and grinding process positioning
• Component positioning on circuit boards
• Positioning for ring pressure-sensitive resistor printing

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